samsung.com - 29 days ago
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Seoul, Korea - November 4, 2009 : Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte ...
samsung.com - 29 days ago
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samsung.com —
Samsung has released a software upgrade for the
SGH-i637 (Jack) which is recommended to be installed. This...
update includes an upgrade to Windows Phone (Mobile) 6.5 and numerous software enhancements. The update may take between 5-10 minutes to ...
(more)
Where Do I Obtain Windows Phone (Mobile) 6.5 For My ...
MobileBurn.com - 29 days ago
slashgear.com - 23 days ago
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slashgear.com —
Samsung has unveiled a new monitor in Korea
that is packed with features and can be used...
as a HDTV as well. the monitor is the Samsung P2370HD and it has 27-inches of screen space. Being that the thing is called a monitor, we can assume it is aimed at computer users who also want to be able to ...
(more)
Samsung unveils SyncMaster P2770HD monitor with TV tuner ...
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Samsung Unveils Thinnest Flash Memory Chip
TechWeb —
... an unacceptable drop in production yields when chips were less than 30 micrometres thick. The new dies are half that amount and will double the storage capacity in the same size memory package used today. "We have achieved a major reduction in the thickness and weight of a large multi-die package to provide the best solution for combining higher density with multi-functionality in current mobile designs," Tae-Gyeong Chung, VP of the development team within Samsung Electronics, said in a statement released Wednesday. Assuming that power usage remains the same, boosting ...
Samsung slims down NAND memory packaging, wafer-thin gadgets to follow
Engadget —
... Good old Samsung and its obsession with thinness. After finally letting its 30nm 32Gb NAND chips out of the bag in May, the Korean memory maker has now successfully halved the thickness of its octa-die memory package to a shockingly thin 0.6mm (or 0.02 ...
Samsung announces new .6mm-thick NAND memory package
TechSpot —
Samsung announced that it has produced the world's thinnest multi-chip memory package for smartphones, portable media players, and other devices. The package measures a mere .6mm in height and contains 32GB of storage. Samsung's new product is 40% thinner and lighter than currently available memory packages. The .6mm-package contains eight 30nm, 32Gb NAND flash chips, each measuring only 15um (.015mm) thick. This super thin multi-die memory package overcomes the conventional technology limits of a chip's resistance to external pressure when under 30um in height, and will ...
Samsung 0.6mm-thick 8-chip NAND Memory Package
iTech News Net —
... overcomes the conventional technology limits of a chip’s resistance to external pressure when under 30um in height. The productivity decline resulting from this thickness limitation had been directly attributable to a drop in production yields during mass production.
The 15um-thickness represents a significant achievement as it can allow for double the density of previous multi-chip packages. The thinner die also dramatically reduces chip weight.
[samsung] ...
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Image via Samsung.com
Rooted in the belief that competition in the app marketplace is good for everyone, a lot of people are excited this week about Samsung's plan to launch a new mobile application store this month.
eWeek reports that:
Quote:
Samsung's ...
Samsung Dual View TL220 Digital Camera Features and Specs
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